Broadcom CPO, Officially Launched
Broadcom launches 3rd-gen 200G/lane CPO, advancing AI interconnects with low power, high density & ecosystem maturity for next-gen data centers.
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Recently, Broadcom announced the launch of its third-generation single-channel 200G (200G/lane) Co-Packaged Optics (CPO) product line, marking significant progress in its CPO technology.
In addition to the 200G/lane breakthrough, Broadcom also showcased the maturity of its second-generation 100G/lane CPO products and ecosystem, highlighting key improvements in OSAT processes, thermal design, handling procedures, fiber routing, and overall yield.
An increasing number of industry partners have publicly announced their participation, further underscoring the maturity of Broadcom’s CPO platform, which supports AI scale-out and scale-up applications for large-scale AI deployments.
Broadcom’s leadership in the CPO field began in 2021 with the introduction of the first-generation Tomahawk 4-Humboldt chipset, enabling the entire CPO supply chain to gain early experience and stay ahead of the industry. This groundbreaking chipset introduced several key innovations, including high-density integrated optical engines, edge coupling, and detachable fiber connectors.
Building on this success, the second-generation Tomahawk 5-Bailly (TH5-Bailly) chipset became the industry’s first mass-produced CPO solution. During the production of TH5-Bailly, Broadcom focused on automated testing and scalable manufacturing processes, laying the foundation for the mass production of future generations. The deployment of Broadcom’s 100G/lane CPO product line has provided the company with unparalleled expertise in CPO system design, enabling seamless integration of optical and electrical components to maximize performance while delivering the industry’s lowest power consumption for optical interconnects.
Today, with the release of the third-generation 200G/lane CPO product line and a commitment to developing fourth-generation 400G/lane solutions, Broadcom continues to lead the industry in providing optical interconnects with the lowest power consumption and highest bandwidth density.