Glass Substrate: Intel Discloses Details for the First Time
Intel unveils glass core substrate breakthrough at NEPCON Japan 2026, showcasing EMIB-embedded 78mm prototype with 20-layer RDL stack and crack-free manufacturing for next-gen AI accelerators
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![[Eng Sub] Intel EMIB](https://substackcdn.com/image/fetch/$s_!3eH3!,f_auto,q_auto:good,fl_progressive:steep/https%3A%2F%2Fsubstack-post-media.s3.amazonaws.com%2Fpublic%2Fimages%2Fddbe8551-3112-40dd-a186-55140c759a87_1280x720.jpeg "[Eng Sub] Intel EMIB")
At the “NEPCON Japan 2026” electronics manufacturing and packaging technology exhibition held at the Tokyo International Exhibition Center in January 2026, Intel showcased its “glass core substrate,” a next-generation packaging technology that had previously been rumored to be stuck in the “lab stage” or even “discontinued.” This display indicates that the company is steadily progressing toward practical application.
The prototype unveiled at this event is a full-size model measuring 78mm x 77mm, integrating Intel’s flagship 2.5D packaging technology—EMIB (Embedded Multi-die Interconnect Bridge)—directly into a glass substrate. This move signals that Intel Foundry, leveraging its advantage in “breaking through physical limits,” is officially entering the AI accelerator market long dominated by NVIDIA and AMD.
Why glass now? The answer lies in the physical constraints arising from the increasing size of AI chips, such as warpage and excessively high wiring density.
