The Big Four EDA Giants: Predicting the Future
EDA giants reveal AI's impact on chip design: 3D-ICs, digital twins, and agentic AI reshaping semiconductor workflows and engineering.
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Artificial intelligence is penetrating the entire semiconductor ecosystem, forcing fundamental changes in AI chips, the design tools used to manufacture them, and the methods used to ensure their reliable operation.
This is a global race that will redefine virtually every field over the next decade. In speeches and interviews over the past few months, senior executives from EDA companies have outlined three major trends that will be the focus of attention for the foreseeable future:
AI itself is expanding from strictly controlled machine learning to AI assistants, generative AI, and agentic AI.
This shift requires processing massive amounts of data to create large language models and algorithms. Due to scaling limitations, it is driving a shift toward multi-chip assembly. The optimal choice is 3D-IC.
Chips and systems need to be monitored throughout their entire lifecycle to ensure reliability. AI is prone to hallucinations, and complex systems filled with chips may degrade in unexpected ways over time, leading to silent data corruption, incompatible software updates, and accelerated aging caused by changing workloads.