Research

Top Three Chip Equipment Giants: Latest Insights

Semiconductor equipment giants diverge on 2025 outlook. Applied Materials, KLA, and Lam Research reveal different tech bets amid AI boom and…

Sep 21 •

Is Open RAN Dead?

Is Open RAN dead? Mavenir's exit & AT&T's Ericsson deal raise doubts. But Nokia claims full commitment to Open RAN & Cloud RAN. Explore the future of 5G…

Sep 17 •

2nm: Indispensable

2nm semiconductors: powering the next leap in AI, IoT, and computing with 45% higher performance and 75% lower energy use. The future of tech.

Sep 15 •

Silicon Photonics and CPO: The Next Big Thing

Silicon Photonics & CPO: The next big thing in AI data centers. Revolutionizing speed, efficiency & scalability. Led by NVIDIA, Broadcom & TSMC.

Sep 3 •

HBM Chips at a Crossroads

HBM4 era: Base Die shifts to foundry processes. Samsung, SK Hynix, Micron adopt different strategies to lead AI memory innovation.

Aug 31 •

Breaking Through the DRAM and SRAM Bottlenecks

Overcoming SRAM & DRAM scaling limits with specialized memory architectures: Introducing LtRAM for persistent data and StRAM for transient workloads.

Aug 29 •

RISC-V Set to Reshape This Category of Chips

RISC-V challenges ARM in DPUs with open ISA, customization, and AI acceleration. Reshaping data center infrastructure with scalable, licensable cores.

Aug 27 •

Is It Feasible to Develop AI Chips In-House?

TPU7: Can You Build AI Chips Like Google? Explore the challenges and feasibility for OTT companies in chip development.

Aug 26 •

The End of Copper Interconnects?

The end of copper interconnects? Ruthenium emerges as a superior alternative for sub-10nm chips, offering lower resistance and better scalability.

Aug 22 •

Chip Giants Battle for NPU Supremacy

NPUs boost AI performance in laptops, saving battery & speeding up tasks. Chip giants race for NPU dominance.

Aug 11 •

UCIe 3.0 Arrives: Chiplet Interconnection Speed Doubled

UCIe 3.0 doubles chiplet interconnect speed to 64 GT/s, boosting AI/HPC performance while ensuring backward compatibility.

Aug 10 •

Ultra-Thin 2D Materials: Challenging the Limits of Silicon Chips

Ultra-thin 2D semiconductors challenge silicon limits, enabling faster, smaller, energy-efficient chips for AI & quantum computing.

Aug 2 •

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